Growth Techniques

FACILITIES

Ultra high Vacuum Pulsed Laser Deposition (UHV-PLD) with RHEED Gun and RF cell

Nanostructures


PLD system having target carousel with capability of 06 solid targets (less than and equal to 2” dia.

Nanostructures


PLD system for Large Area Deposition (2inch dia.) using solid/liquid targets

Nanostructures


Excimer Laser, KrF (248 nm) for PLD (Coherent)

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Nd:YAG Laser (4th Harmonics, 266 nm) for PLD (Continum)

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Magnetron Sputtering System (Multilayer, Confocal & GLAD configurations)

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Balanced and Unbalanced Magnetron Sputtering (up to 6” targets)

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Pulsed DC Sputtering for metallization (bi-layer system)

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Power Supplies (RF, Pulsed DC and DC) for Sputtering (Comdel, Advanced Energy, Hattinger)

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Electron beam (E-beam) evaporation system (up to 8” dia wafers) with telemark gun

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Vacuum Thermal Evaporation system for metallization

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Sol-Gel Spin Coating Technique

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PC controlled Dip coater/etching system

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Langmuir-Blodgett deposition technique for monolayer

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Optical Emission Spectroscopy for Plasma diagnosis

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Chemical Vapor Deposition for CNTs

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Vapor Solid Transport (VST) technique for oxide nanostructures

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Centrifuge, Ultra-sonicators, Magnetic Stirrers, Hot plates etc.

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Conventional Ball Mill

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High speed Ball Mill

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Hydraulic Press (Cold and Hot)

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Temperature Controlled Muffle and Tubular Furnace

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Programmable Muffle Furnace (Nebertherm)

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Gas and Vacuum annealing facility

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Microwave furnace

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De-ionized and distilled water plant

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Refluxing and degreasing system

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