Mask designing using L-edit

Nanostructures


On-line UPS (40kVAx2)

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Optical Microscope (Leica)

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Wire Bonder (West Bond)

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Semi-automatic Dicing machine (Disco)

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Thickness Profilometer (Dektak)

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Class 100 and Class 1000 clean area space

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Probe station (Cascade) interface with Cryostat and Keithley 4200 SCS

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Spin coater for photoresist (Karl-Suss)

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Reactive Ion Etching (RIE) System (Plasma Therm)

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Plasma Enhanced Chemical Vapor Deposition (PECVD) (Plasma Therm)

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Oxidation Furnace

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Mask Aligner with Nano-imprint Lithography (MA6, KarlSuss)

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